interpack 2011: Smart Packages for Freshness
Industry sees huge potential in chips and is eagerly pursuing their development. The Organic Electronics Association (OE-A), a work group at the German Engineering Federation (VDMA), is working on the commercialisation of printable organic electronics. “Inexpensive, thin, flexible electronics, which, attached to flexible polyester substrates, can be easily integrated into packaging, will soon be a familiar feature in the retail industry,” says OE-A Chairman Wolfgang Mildner. With RFID, large volumes of information on goods can be retrieved or uploaded in a flash. The technology thus stands for a guarantee of authenticity and for distribution security. At interpack from 12 to 18 May 2011, one of the world’s foremost events in the packaging industry, “communicative” packaging will also be high on the agenda.
- Places:
- Chicago
- Switzerland