UV & EB Packaging Conference Scheduled for April
CHICAGO—RadTech will present e|5: UV & EB Technology Expo & Conference, April 24-26, 2006 at Lakeside Center at McCormick Place in Chicago. Learn "why" and "how" converters and consumer packaged goods (CPG) companies are rapidly transitioning to UV and EB technology in an exciting forum and panel discussion devoted to delivering the value proposition for both the print-buyer and print seller. The Panel will discuss troubleshooting with UV/EB, transitioning to UV/EB and the benefits of converting to UV/EB technology.
Bring questions for the panelists to get the expert opinion on UV and EB curing!
On Tuesday, April 25, RadTEch will be hosting a panel with the following confirmed panelists:
• Masterfoods USA
• Printpack, Inc.
• Energy Sciences Inc.
• Prime UV Systems
• Northwest Coatings
• Sun Chemical
• IST America Corp
• More Panelists to Be Added Soon.
For more information on this event, please visit www.e52006.com or call (240) 497-1243 for a brochure.