McCormick Place Archives - Packaging Impressions

June 11, 2013Workflow Lab, Standards, Conference at PRINT 13

Managing content for multiple channels is the key to a future of growth and profitability.

September 13, 2011INX International to Introduce EcoTech™ Low Migration Inks at GraphExpo 2011

SCHAUMBURG, IL -- Continuing to deliver new and advanced products to market, INX International Ink Co. will introduce a timely addition to its line-up of process color inks for the sheetfed side of the industry. INX (booth #427) will roll out the new EcoTech™ LM (Low Migration) inks at the Graph Expo show, which takes place from September 11-14 in Chicago at McCormick Place. The new EcoTech™ Low Migration sheetfed process color inks offer high performance and are designed specifically for the folding carton market. The EcoTech LM system is formulated without mineral oil, is cobalt-free and has minimal

September 13, 2011Stephenson Printing orders first ROLAND 700 HiPrint HS in North America

McCormick Place, Chicago- As soon as visitors to manroland's Print Technology Center have had a chance to see the Roland 700 HiPrint High Speed press in operation at a blinding 18,000 sheets per hour, it will be shipped to Stephenson Printing (Alexandria, VA) to upgrade the versatile printer's sheetfed printing operations. George Stephenson, President of Stephenson Printing said, "While the high printing speed is nice to have, we really bought the ROLAND 700 HiPrint HS press because it has all the latest integrated technologies that support fast makereadies. This will allow us to print 500 or 15,000 copies or

October 29, 2010Coating Excellence International (cei) to Showcase Its Diverse Portfolio of Flexible Packaging and T

Coating Excellence International (cei) the Wisconsin-based market leading flexible packaging and technical products company, today announced that it will be exhibiting its diverse product portfolio at Pack Expo 2010, held at McCormick Place in Chicago, October 31st through November 3rd, 2010 - booth #8027. cei will be showcasing its extensive line of flexible packaging solutions. These innovative solutions are designed to optimally meet the most demanding needs in the market today including a wide variety of packaging formats, barrier controls and an extensive array of convenience features. cei's three flexible packaging facilities provide backup manufacturing processes and logistic efficiencies.

October 22, 201010 Designers Are Finalists in Project 2020 at PACK EXPO

PMMI announced 10 package designers and developers have been named finalists in the “Package of the Future” competition, a key component of Project 2020: The Consumer Experience, sponsored by DuPont being held at PACK EXPO.

October 15, 2010Food Safety Resource Center at PACK EXPO

The Food Safety Summit Resource Center at PACK EXPO International 2010 (McCormick Place, Chicago; Oct. 31-Nov. 3) is set up to help manufacturers and processors respond to the challenges they face on the job.

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