Programming Set for IADD/FSEA 2007 Odyssey

MILWAUKEE, Wis.—Converters of paper, paperboard, corrugated, plastics, laminates, rubber, composites, leather, and more will find practical diecutting and foil stamping/embossing solutions at the 2007 IADD/FSEA Odyssey, May 2-4, 2007, in Milwaukee, Wis. Sponsored by the International Association of Diecutting and Diemaking (IADD) and the Foil Stamping and Embossing Association (FSEA), the Odyssey will offer three days of educational sessions—both in the classroom and on the Techshop floor—designed to educate, solve challenges, and foster open discussions in a variety of converting areas. From diecutting, diemaking, foil stamping and embossing to folding carton, corrugated, and specialty markets, attendees will discover the hottest technologies and real-time solutions to increase profitability and productivity. In addition to the educational sessions, Odyssey attendees will experience a 3-day technical trade exposition and invaluable networking opportunities with industry experts and peers.