Programming Set for IADD/FSEA 2007 Odyssey
MILWAUKEE, Wis.—Converters of paper, paperboard, corrugated, plastics, laminates, rubber, composites, leather, and more will find practical diecutting and foil stamping/embossing solutions at the 2007 IADD/FSEA Odyssey, May 2-4, 2007, in Milwaukee, Wis. Sponsored by the International Association of Diecutting and Diemaking (IADD) and the Foil Stamping and Embossing Association (FSEA), the Odyssey will offer three days of educational sessions—both in the classroom and on the Techshop floor—designed to educate, solve challenges, and foster open discussions in a variety of converting areas. From diecutting, diemaking, foil stamping and embossing to folding carton, corrugated, and specialty markets, attendees will discover the hottest technologies and real-time solutions to increase profitability and productivity. In addition to the educational sessions, Odyssey attendees will experience a 3-day technical trade exposition and invaluable networking opportunities with industry experts and peers.
A sampling of the 2007 line-up includes the following sessions: Diecutting, Nicking, Rubbering, and Communication; Working with Hard to Stamp Surfaces; Foil Stamping and Diecutting Plastics; Working with Foil on Tight Registration Jobs; Total Tool Maintenance (folding carton); Bundle Breaker Rule and Removable Nicking Options; Traditional Rotary Rubbering vs. Water Jet; Engineering a 66-inch Rotary Segmented Die; Laser 101 – Cutting Problems and Solutions; Diecutting and Kiss Cutting Polycarbonates; Troubleshooting Static Electricity, and more.
Visit www.iadd.org/odyssey for complete programming information, details on exhibiting at the Odyssey’s 3-day trade exposition, room accommodations, and more.