Int'l Association of Diecutting and Diemaking (IADD)

IADD/FSEA Odyssey is Looking Forward to 2009
June 6, 2008

ATLANTA, Ga.—Exhibit sales are strong for the 2009 IADD/FSEA Odyssey, to be held May 6-9 in Atlanta, Ga. Sponsored by the International Association of Diecutting and Diemaking (IADD) and the Foil Stamping and Embossing Association (FSEA), the three-day event at the Cobb Galleria will provide information specific to diecutting, diemaking, foil stamping/embossing, and many other trade finishing processes. Changes in scheduling will afford attendees and exhibitors alike the opportunity to experience a wide variety of classroom and TechShop™ educational sessions, with even more time to gather valuable information on industry trends in the Exhibition Hall. Changes also are in store for the increasingly popular

Ken Holliday to Receive IADD Lifetime Achievement Award
March 30, 2007

The International Association of Diecutting and Diemaking (IADD) will present its Lifetime Achievement Award to Ken Holliday, chairman of Atlas Die, LLC, in Decatur, Ga. at the IADD Awards Banquet on May 3, 2007 to be held in conjunction with the IADD/FSEA Odyssey (May 2-4, 2007) at the Midwest Airlines Convention Center in Milwaukee, Wis. Holliday has built or advanced several diemaking companies, always with the desire to make them the best in the industry. His career began in 1965 as a salesman for Carolina Steel Rule Die Co. in Greensboro, N.C. In 1978 he co-owned Holiday Steel Rule Die, and he joined Atlas

Programming Set for IADD/FSEA 2007 Odyssey
January 19, 2007

MILWAUKEE, Wis.—Converters of paper, paperboard, corrugated, plastics, laminates, rubber, composites, leather, and more will find practical diecutting and foil stamping/embossing solutions at the 2007 IADD/FSEA Odyssey, May 2-4, 2007, in Milwaukee, Wis. Sponsored by the International Association of Diecutting and Diemaking (IADD) and the Foil Stamping and Embossing Association (FSEA), the Odyssey will offer three days of educational sessions—both in the classroom and on the Techshop floor—designed to educate, solve challenges, and foster open discussions in a variety of converting areas. From diecutting, diemaking, foil stamping and embossing to folding carton, corrugated, and specialty markets, attendees will discover the hottest technologies and real-time solutions

IADD/FSEA 2007 Odyssey Close to Exhibit Sell-out
November 22, 2006

IADD/FSEA 2007 Odyssey Close to Exhibit Sell-out The International Association of Diecutting and Diemaking (IADD) and the Foil Stamping and Embossing Association (FSEA) are excited to report a record-breaking number of exhibitors registered for the 2007 IADD/FSEA Odyssey, May 2-4, 2007, at the Midwest Airlines Center in Milwaukee, Wisconsin, USA. “Currently, we are at 90% of exhibit capacity – far surpassing our numbers from the 2005 Odyssey held in Atlanta,” exclaimed IADD Chief Executive Officer Cindy Crouse. “This is a testament to the increasing value the Odyssey continues to provide to both exhibitors and attendees alike.” From machinery and supplies to raw materials