PIA/GATF Announces InterTech Technology Award Recipients
SEWICKLEY, Pa.—Printing Industries of America/Graphic Arts Technical Foundation (PIA/GATF) announced the recipients of the 2007 InterTech Technology Awards. The independent panel of judges deliberated over technology submissions ranging from printing presses to software solutions to ancillary services.
A recurring theme with 2007 InterTech nominations was green printing, and numerous submissions contained solutions to minimize the environmental impact of printing. Great strides in technology were also demonstrated in the form of innovative press design, touchless workflow systems to automate production steps, anti-fraud measures, and new materials and systems that increase productivity.
Recipients were recognized from across the entire production workflow. Thirty-one nominations were submitted, and 11 technologies were selected to receive the award.
The 2007 InterTech Technology Award recipients are:
(Listed alphabetically by company, with the technology named first)
• Energy Elite Dual Layer “No Bake” Plate
AGFA Graphics N.V.
• Kodak Traceless System
Eastman Kodak Company
• EIS UV Printing Blanket Refurbishment
Enviro Image Solutions, Inc.
• Esko DeskPack 3-dX
• Fujifilm C-Fit Image Intelligence Software
FUJIFILM Graphic Systems, Inc.
• Font Emulation in the Harlequin RIP
Global Graphics Software, Inc.
• Heidelberg Anicolor Inking Unit
Heidelberg USA, Inc.
• Heidelberg Speedmaster XL 105
Heidelberg USA, Inc.
• KBA Sensoric Infeed System
KBA North America, Inc.
• ROLAND 700 DirectDrive
MAN Roland Druckmaschinen AG
• Océ VarioPrint 6250 Digital Printer
Océ North America, Inc.
A technology review booklet showcasing all thirty-one of the current year’s nominated technologies will be produced by Graphic Arts Monthly for release in Fall 2007. The Lucite InterTech stars, recognized as a symbol of technological innovation and excellence, will be presented to the 2007 award recipients before an audience of industry leaders during the 2007 PIA/GATF Fall Administrative Meetings, November 8–11 in Chicago, Ill.