Parelec Inc. Teams with TAGSYS for Direct-on-Packaging RFID Solution

ROCKY HILL, N.J.—Parelec Inc. has announced the development of a breakthrough in direct-on-packaging RFID in partnership with TAGSYS, USA (Cambridge, MA), the global leader in item-level RFID infrastructure.

The commercially viable RFID tag system can be printed on corrugated packaging using Parelec’s Parmod VLT ink. This patented technology is comprised of metal particles in a reactive organic medium (ROM) that volatize during the heating process. Thin, narrow circuit lines are possible using efficient single station printing. The result is a faster, lower cost process with more highly conductive circuits. Parmod technology from Parelec and the Adaptive Kernal UHF technology from TAGSYS print the RFID tag directly to the package allowing customers to optimize the fit and performance of the tag to each unique product package while saving time and cost in production.