Xennia Introduces Inkjet Solutions at Pack Expo
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Xennia, a provider of industrial inkjet solutions, will demonstrate its XenJet inkjet module range and versatile industrial inkjet solutions for packaging applications at Pack Expo, Chicago, on October 31 - November 3, 2010.
Xennia will showcase its XenJet print engine, fluid control and print software modules—the key elements of any reliable inkjet system—for use in applications such as flexible, box, carton and rigid package printing. The Xennia Sapphire inkjet printing system will demonstrate an example configuration of these modules using XenInx Diamond high performance UV cure ink to print onto a range of packaging substrates including examples of variable data printing (VDP).
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