OMET to Host 'Future of Flexo' Open House at Clemson

OMET Americas is hosting its first open house at Clemson’s Sonoco Institute of Packaging Design and Graphics on February 6-7 in South Carolina.

Join the free event to connect with vendors from across the flexo industry. Explore their latest technologies to determine which industry advancements you should consider for your 2019 budget planning.

This two-day event will offer speaker presentations, OMET press demos, networking opportunities and free food! Visit vendors like Phoseon, Siegwerk, Harper, Nazdar, Techkon, DuPont and Eaglewood. Durst will also be present to facilitate discussions around digital inkjet technology, capabilities and justification.

OMET Americas and Clemson’s Sonoco Institute have partnered over the years in many ways to provide advanced printing capabilities to Clemson students and the industry. OMET’s Varyflex 530 narrow-web press provides an opportunity for students and partners to experience hands on learning in the basics of press operation, color management, process control and more. The press is placed in the Institute’s Advanced Print Lab which also houses ink and platemaking capabilities.

The Sonoco Institute is also one of OMET’s designated Future of Flexo schools, receiving additional support from OMET to ensure that students gain exposure to the modern technologies and skills employees are using in the flexographic field.

Please visit SonocoInstitute.com/Events to register for this free event.

Source: Clemson University.

The preceding press release was provided by a company unaffiliated with packagePRINTING. The views expressed within do not directly reflect the thoughts or opinions of the staff of packagePRINTING.