MacDermid Combines LUX, LAVA; Adds xpedx
INDIANAPOLIS, Ind.—MacDermid Printing Solutions announced that the LUX platemaking process can now be used with LAVA thermal processing systems. The combination of flat-top dots with thermal processing is an industry first and offers a unique opportunity for printers and converters to merge the quality and consistency of LUX with the efficiency and environmental benefits of LAVA.
“The results have been outstanding,” said Timothy Gotsick, MacDermid’s Global Director of Innovation. “Thermal LUX combines the print advantages of LUX with the speed and environmental characteristics of thermal platemaking with LAVA. These technologies just belong together because they address so many needs for both platemakers and printers—convenience, versatility, lowered environmental impact, and superb print quality. And all ready to work today with current digital platemaking workflows. We are excited to offer this unique combination of technologies to our customers.”
In conjunction with the introduction of this new capability, MacDermid announced that LUX Laminators are now available in two format sizes: the original 62˝ and a new 38˝ model. The new LUX laminator laminates plates up to 38˝ in width and includes several new features that make lamination of the LUX membrane easier and more efficient. This new LUX Laminator, in combination with the LAVA 2530 Plate Processing System, is a combination ideally suited to the narrow web market. The LUX Process has been print-proven on a wide variety of substrates—including paper, flexible film, foil, paperboard, labelstock, and corrugated.
In addition, MacDermid Printing Solutions is now using xpedx to distribute MacDermid’s photopolymer plate products and equipment in the United States. With the addition of xpedx to its distribution roster, MacDermid is now represented in distribution via two outlets: xpedx and JV Imaging Solutions, Inc. MacDermid’s full range of products encompasses both analog and digital plate imaging technologies as well as solvent and thermal plate development processes.