Kodak Brings Solutions to Package Design ‘07 Conference

ROCHESTER, N.Y.,—At the upcoming Package Design 07 Conference, Kodak will show package designers and brand owners how a combination of workflow, thermal computer to plate, and digital proofing solutions can help ensure consistent, accurate brand colors and packaging. Co-produced by Packaging Strategies and Package Design Magazine, the Package Design 07 Conference takes place Jan. 30–Feb. 1 at the International Plaza Resort & Spa in Orlando, Fla. In addition to exhibiting, Kodak serves as a sponsor of the three-day conference.