Goss Rolls Out Vpak at Technology Center Demo Week

DURHAM, NH—October 30, 2014—Following weeks of closed testing sessions and private demonstrations since its April launch, the Goss Packaging Technology Center recently held its first “open” demonstration week.

More than 40 prospects representing a range of packaging facilities across the United States and Canada, from small independents to multi-plant operations, made the trip to see live demonstrations of the Sunday Vpak web offset press and explore new opportunities in packaging print production.

Over four days in October, visitors observed the Vpak 500 model running both 76-micron OPP film and 8-point SBS paper board and employing a variety of additional in-line capabilities, including high-gloss flexo coatings and EB curing. The Goss team on-site also demonstrated the unique advantages of the Sunday Vpak quick-change sleeve technology which allows for very fast, reliable and economical job changes.

Peter Walczak, director of product management for packaging, noted, “The event was hugely positive and beneficial, both for Goss and all our technology partners, as well for our guests.”

According to Walczak, some attendees were early contributors to the Vpak development. “We had a couple of visitors who were involved in discussions when the technology was at an early engineering stage," he said. "They were really pleased to see the machine performing and to know that their input had contributed to an industry gamechanger.”

“The Packaging Technology Center provides converters and brand owners the chance to generate and test new concepts for improved packaging printing first-hand,” said Walczak.

In addition to an ongoing schedule of trials and demonstrations, Goss is planning a series of events at the Packaging Technology Center focused on specific educational topics. Color management and ink curing will be among the first themes covered, with input from Goss partners and consumables suppliers.

More information is available from matt.adler@gossinternational.com.