Scottsdale, Ariz.

ROCHESTER, N.Y.—Diamond Packaging won five awards in the 15th Annual FSEA Gold Leaf Awards Competition, which showcases foil stamping and embossing designs and techniques. Awards were announced at the 2008 FSEA National Convention, held in Scottsdale, Ariz. The competition, which is sponsored by the Foil Stamping & Embossing Association (FSEA), recognizes creativity and superior execution of designs that reflect positively on the industry as a whole. Entries are judged on several criteria including design, execution, and level of difficulty. Winning an award is a mark of excellence in the packaging field and recognition of superior achievement. Competing against hundreds of entries from around the

SCOTTSDALE, Ariz.—IMLCON07, the 15th International In-mold Labeling Conference—organized by AWA Conferences & Events—will be held Oct.10-12 Scottsdale, Ariz. at the Radisson Fort McDowell Resort. IMLCON attracts delegates annually from around the world and from all aspects of this growing and dynamic industry—from raw material suppliers, machinery manufacturers, and converters to end users. This year’s program focuses on the key developments in the industry in terms of new materials, technologies, applications, and market trends, and features a diverse program of international speakers. On the second day, much of the program is given over to a series of concurrent workshops led by the In-Mold Decorating Association

SCOTTSDALE, Ariz.—IMLCON07, the 15th International In-mold Labeling Conference—organized by AWA Conferences & Events—will be held Oct.10-12 Scottsdale, Ariz. at the Radisson Fort McDowell Resort. IMLCON is the only conference totally dedicated to in-mold labeling and decorating and its technology and markets. It attracts delegates annually from around the world, and from all aspects of this growing and dynamic industry—from raw material suppliers, machinery manufacturers, and converters to end users. This year’s program focuses on the key developments in the industry in terms of new materials, technologies, applications, and market trends, and features a strong program of international speakers. On the second day, much of