Chip Tonkin

Director , Sonoco Institute of Packaging Design and Graphics: What role will active and intelligent components play in future food and drink packaging? We caught up with Chip Tonkin, director of the US based Sonoco Institute of Packaging Design and Graphics at Interpack 2011 to find out. He stressed that cost is still a major factor in brand owners choosing new packaging materials, and without economies of scale, a lot of active and intelligent packaging developments remain stuck in the pilot production phase. And Tonkin explained how the Institute, based at Clemson University, is exploring how to make active

NORTH ROYALTON, Ohio—GEW has donated a seven-lamp ECP UV system with e-brick electronic power supplies to aid research and development activities at Clemson University’s new Sonoco Institute of Packaging Design and Graphics.

On March 31, Clemson University dedicated the Harris A. Smith Building, home to the Sonoco Institute of Packaging Design and Graphics, where students and researchers will study not only how packaging is designed and manufactured, but also how products will be perceived, marketed and consumed in the future.

LECCO, Italy—OMET S.r.l has formed a partnership with Clemson University’s new Sonoco Institute of Packaging Design and Graphics. The Institute will be housed in the Harris A. Smith building. The emphasis will be on printed electronics and the hope is that with the help of industry suppliers and leaders that Clemson will be able to break new ground in this emerging market.