Esko Supports Education at PACK EXPO
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RESTON, VA.—PMMI, the Association for Packaging and Processing Technologies, and the owner and organizer of PACK EXPO, announced that Esko will be the exclusive sponsor of the Clemson University Packaging Emporium: Design for the Future at PACK EXPO Las Vegas 2013 (September 23 - 25; Las Vegas Convention Center).
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